Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5376824 | Method and an encapsulation for encapsulating electrical or electronic components or assemblies | Hans-Fr. Schmidt, Juergen Bednarz, Karl-Heinz Horsmann, Ralf Criens, Horst Scheffler +1 more | 1994-12-27 |
| 5106785 | Method for encapsulating electronic components or assemblies using a thermoplastic encapsulant | Hans-Fr. Schmidt, Juergen Bednarz, Karl-Heinz Horsmann, Ralf Criens, Horst Scheffler +1 more | 1992-04-21 |
| 5008496 | Three-dimensional printed circuit board | Hans-Fr. Schmidt, Juergen Bednarz | 1991-04-16 |