Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer base for silicon carbide semiconductor devices, incorporating alloy substrates

Wafer base for silicon carbide semiconductor devices, incorporating alloy substrates

US Patent 5043773 · Granted Aug 27, 1991

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Air cavity package using high temperature silicone adhesive2022
Metal-on-ceramic substrates2021
Sputtering target having RFID information2021
Copper flanged air cavity packages for high frequency devices2018
Air cavity packages having high thermal conductivity base plates and methods of 2015
Semiconductor packages having metal composite base plates2015
Surface mount package for a high power light emitting diode2007
Ceramic composition having high adsorptive capacity for oxygen at elevated tempe2002
High temperature pressure swing adsorption system for separation of oxygen-conta2002
Method and binder for use in powder molding1994
Method of making galvanically dissipatable evanescent chaff fiber1993
Wafer base for silicon carbide semiconductor devices, incorporating alloy substr1993