Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11227806 | Air cavity package using high temperature silicone adhesive | Chee Kong Lee, Wei Chuan Goh, Sin Yee Chin | 2022-01-18 |
| 11046051 | Metal-on-ceramic substrates | — | 2021-06-29 |
| 10896812 | Sputtering target having RFID information | Michael V. Pasquariello, Thomas P. St. Vincent, Matthew T. Willson | 2021-01-19 |
| 10163743 | Copper flanged air cavity packages for high frequency devices | Chee Kong Lee, Wei Chuan Goh, Sin Yee Chin | 2018-12-25 |
| 9117793 | Air cavity packages having high thermal conductivity base plates and methods of making | George Michael Wityak | 2015-08-25 |
| 9035448 | Semiconductor packages having metal composite base plates | George Michael Wityak | 2015-05-19 |
| 7157744 | Surface mount package for a high power light emitting diode | William Palmteer, Thomas Yuan | 2007-01-02 |
| 5190890 | Wafer base for silicon carbide semiconductor devices, incorporating alloy substrates, and method of making the same | Walter Precht, Donald Kupp, Delwyn Cummings | 1993-03-02 |
| 5087434 | Synthesis of diamond powders in the gas phase | Michael Frenklach, Karl E. Spear | 1992-02-11 |
| 5043773 | Wafer base for silicon carbide semiconductor devices, incorporating alloy substrates | Walter Precht, Donald Kupp, Delwyn Cummings | 1991-08-27 |