Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11227806 | Air cavity package using high temperature silicone adhesive | Richard J. Koba, Chee Kong Lee, Sin Yee Chin | 2022-01-18 |
| 10163743 | Copper flanged air cavity packages for high frequency devices | Richard J. Koba, Chee Kong Lee, Sin Yee Chin | 2018-12-25 |
| 6804739 | Structure and method for message snooping in SCSI bus expanders | B. Arlen Young, John S. Packer | 2004-10-12 |