Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor packages having metal composite base plates

Semiconductor packages having metal composite base plates

US Patent 9035448 · Granted May 19, 2015

Estimated economic value: $6,041,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Air cavity package using high temperature silicone adhesive2022
Metal-on-ceramic substrates2021
Sputtering target having RFID information2021
Copper flanged air cavity packages for high frequency devices2018
Light emitting diode2016
Direct cooled rotary sputtering target2016
Air cavity packages having high thermal conductivity base plates and methods of 2015
Air cavity packages having high thermal conductivity base plates and methods of 2015
Rotary target backing tube bonding assembly2015
Reflective or semi-reflective metal alloy coatings2009
Surface mount package for a high power light emitting diode2007
Silicon target assembly2004