Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Solder mound formation on substrates

Solder mound formation on substrates

US Patent 4434434 · Granted Feb 28, 1984

Estimated economic value: $19,635,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Authorized access list generation method and information security system using s2023
Network malicious behavior detection method and networking system using same2023
Authentication of a print request2018
Tacking processes and systems for soldering1999
High throughput manufacturing of thin film data recording disks1997
Fluxless soldering sample pretreating system1996
Recessed via apparatus for testing, burn-in, and/or programming of integrated ci1995
Electrical connector including variably spaced connector contacts1995
Fluxless soldering of copper1995
Method of forming differing volume solder bumps1995
Apparatus for testing, burn-in, and/or programming of integrated circuit chips, 1994
Variable size capture pads for multilayer ceramic substrates and connectors ther1994