Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package structure with buffer layer embedded in lid layer

Package structure with buffer layer embedded in lid layer

US Patent 12406897 · Granted Sep 2, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device including stress control layer and methods of forming the s2025
Semiconductor package and method of manufacture2025
Semiconductor package and method of manufacture2025
Semiconductor package and method of manufacture2025
Semiconductor package and method of manufacture2025
Dicing process in packages comprising organic interposers2025
Dicing process in packages comprising organic interposers2025
Package structure2025
Semiconductor package including stress buffers and methods of forming the same2025
Semiconductor package including stress buffers and methods of forming the same2025
Semiconductor structure and manufacturing method thereof2025
Integrated fan-out package having stress release structure2025