Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Fabrication of substrate support devices using inorganic dielectric bonding

Fabrication of substrate support devices using inorganic dielectric bonding

US Patent 12400896 · Granted Aug 26, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Increasing the gas efficiency for an electrostatic chuck2025
Extreme uniformity heated substrate support assembly2025
Semiconductor substrate support with internal channels2025
Modular substrate support assembly2025
Electrostatic chuck assembly for cryogenic applications2025
Cryogenic micro-zone electrostatic chuck connector assembly2025
Cooled substrate support assembly for radio frequency environments2025
Tunable temperature controlled substrate support assembly2025
Temperature controlled substrate support assembly2025
Electrostatic chuck with mesas2025
Ground electrode formed in an electrostatic chuck for a plasma processing chambe2025
Substrate carrier2024