Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Structure and process for photonic packages

Structure and process for photonic packages

US Patent 12392961 · Granted Aug 19, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Photonic semiconductor-insulator-semiconductor modulator and methods for forming2025
Semiconductor device having redistribution layers formed on an active wafer and 2025
Photonic semiconductor device and method of manufacture2025
Photonic package and method of manufacture2025
Photonic package and method of manufacture2025
Semiconductor structure and method of manufacturing the same2025
Structure having thermal dissipation structure therein and manufacturing method 2025
Thermo-electric cooler for dissipating heat of optical engine2025
Thermo-electric cooler for dissipating heat of optical engine2025
Integrated circuit package and method2025
Semiconductor device having underfill surrounding bottom package and solder ball2025
Apparatus, system and method2025