Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Hybrid chip carrier package

Hybrid chip carrier package

US Patent 12374608 · Granted Jul 29, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Back end of line structure for improved current density in HR devices2025
Semiconductor device with multiple dies2025
Electronic device and multilevel package substrate with integrated filter2025
Electronic device with patch antenna in packaging substrate2025
Flip-chip enhanced quad flat no-lead electronic device with conductor backed cop2025
Multilayer package substrate with stress buffer2025
Dog tie out anchor2025
Microelectronic device package including antenna and semiconductor device2025
Microelectronic device package including antenna and semiconductor device2025
Plated metal layer in power packages2025
Plated metal layer in power packages2025
Electronic device multilevel package substrate for improved electromigration per2025