Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Board-level pad pattern for multi-row QFN packages

Board-level pad pattern for multi-row QFN packages

US Patent 12309921 · Granted May 20, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Board-level pad pattern for multi-row QFN packages2025
Board-level pad pattern for multi-row QFN packages2025
Board-level pad pattern for multi-row QFN packages2025
Board-level pad pattern for multi-row QFN packages2025
Compliant mechanical system for mini/micro chip mass transfer and packaging2023
Flexure-based continuous ejector pin mechanism for mini/micro chip mass transfer2023
Microelectromechanical systems package structure2020
Stiffness-frequency adjustable XY micromotion stage based on stress stiffening2019
Layout method for printed circuit board2017
Semiconductor device having a charged insulating layer2016
Layout method for printed circuit board2015
Keypad device and operation method thereof2006