Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and system for adjusting the gap between a wafer and a top plate in a thin-film deposition process

Method and system for adjusting the gap between a wafer and a top plate in a thin-film deposition process

US Patent 12266579 · Granted Apr 1, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Bimetallic monatomic nano-enzyme electrochemical sensor, and preparation method 2025
Array substrate and manufacturing method therefor, electronic paper display appa2025
Electronic paper and display device2025
Composite etch stop layers for sensor devices2025
Composite etch stop layers for sensor devices2025
Circuit design and layout with high embedded memory density2025
Semiconductor structure and forming method thereof2025
Air compressor2025
Deep trench isolation structure and methods for fabrication thereof2025
Memory device structure with data storage element2025
Vehicle-mounted air compressor2025
Cap2025