Semiconductor package with intermetallic-compound solder-joint comprising solder, UBM, and reducing layer materials

Assignee

• KAIST

Inventors

• Kwang-Seong Choi (35 patents)
• Yong Sung EOM (29 patents)
• Jiho JOO (29 patents)
• Gwang-Mun CHOI (9 patents)
• Seok-Hwan MOON (17 patents)
• Chanmi Lee (8 patents)
• Ki Seok Jang (26 patents)

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