Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wrap-around contact for nanosheet device

Wrap-around contact for nanosheet device

US Patent 12176404 · Granted Dec 24, 2024

Estimated economic value: $24,905,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Enhanced linerless vias2025
Gate-all-around field-effect-transistor with wrap-around-channel inner spacer2025
Semiconductor structure with backside metallization layers2025
Integration of nanosheets with bottom dielectric isolation and ideal diode2025
TSV and backside power distribution structure2025
Wraparound contact with reduced distance to channel2025
Wraparound contact with reduced distance to channel2025
Wraparound contact with reduced distance to channel2025
Nanowire source/drain formation for nanosheet device2025
FinFET gate cut after dummy gate removal2025
Local enlarged via-to-backside power rail2025
Skip-level TSV with hybrid dielectric scheme for backside power delivery2025