Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method

Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method

US Patent 12165959 · Granted Dec 10, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

U-LED, U-LED device, display and method for the same2025
μ-LED, μ-LED device, display for augmented reality or lighting applications2025
μLED chip architecture based on nanostructured perovskite converter materials2025
LED module, LED display module and method of manufacturing the same2025
Semiconductor laser and method of production for optoelectronic semiconductor pa2025
Method for fabricating a semiconductor device package comprising a pin in the fo2025
Method for fabricating a semiconductor device package comprising a pin in the fo2025
Composite component made of optical components, method for producing a composite2025
Method of manufacturing a hybrid device2025
Molded semiconductor package having an embedded inlay2025
Method and device for producing a housing2025
Semiconductor package2025