Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package and passive element with interposer

Semiconductor package and passive element with interposer

US Patent 12131988 · Granted Oct 29, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Embedded package with shielding pad2025
Embedded package with shielding pad2025
Semiconductor devices including parallel electrically conductive layers2025
Semiconductor devices including parallel electrically conductive layers2025
Semiconductor package with non-uniformly distributed vias2024
Voltage regulator module with inductor-cooled power stage2024
Method of forming a semiconductor module2024
Die package and method of manufacturing a die package2024
Package with clip having through hole accommodating component-related structure2024
Semiconductor module having a multi-branch switch node connector2024
Semiconductor module having a multi-branch switch node connector2024
Circuitry and method of forming a circuitry2024