Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bonded body, ceramic copper circuit substrate, and semiconductor device

Bonded body, ceramic copper circuit substrate, and semiconductor device

US Patent 12115603 · Granted Oct 15, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Antenna device, detection device, opening/closing unit control system, and occup2025
Bonded body, circuit board, semiconductor device, and method for manufacturing b2025
Bonded body, circuit board, semiconductor device, and method for manufacturing b2025
Bonded body, circuit board, semiconductor device, and method for manufacturing b2025
Umami-enhancing composition, seasoning or extract, method for manufacturing umam2025
Electronic device and wrist device2025
Brazing material, bonded body, ceramic circuit board, and method for manufacturi2025
Brazing material, bonded body, ceramic circuit board, and method for manufacturi2025
Brazing material, bonded body, ceramic circuit board, and method for manufacturi2025
Brazing material, bonded body, ceramic circuit board, and method for manufacturi2025
Bonded body including titanium alloy at bonding boundary2025
Bonded body including titanium alloy at bonding boundary2025