Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431406 | Bonded body, circuit board, semiconductor device, and method for manufacturing bonded body | Seiichi Suenaga, Maki Yonetsu | 2025-09-30 |
| 12343820 | Brazing material, bonded body, ceramic circuit board, and method for manufacturing bonded body | Maki Yonetsu, Seiichi Suenaga, Takashi Sano | 2025-07-01 |
| 12347744 | Bonded body including titanium alloy at bonding boundary | Seiichi Suenaga, Maki Yonetsu | 2025-07-01 |
| 12160959 | Bonded body, ceramic copper circuit board, method for manufacturing bonded body, and method for manufacturing ceramic copper circuit board | Maki Yonetsu, Seiichi Suenaga, Takashi Sano | 2024-12-03 |
| 12115603 | Bonded body, ceramic copper circuit substrate, and semiconductor device | Maki Yonetsu, Seiichi Suenaga, Takashi Sano | 2024-10-15 |
| 11948900 | Bonded body, circuit board, and semiconductor device | Maki Yonetsu, Seiichi Suenaga, Takayuki Naba | 2024-04-02 |