Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Brazing material, bonded body, ceramic circuit board, and method for manufacturing bonded body

Brazing material, bonded body, ceramic circuit board, and method for manufacturing bonded body

US Patent 12343820 · Granted Jul 1, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Antenna device, detection device, opening/closing unit control system, and occup2025
Bonded body, circuit board, semiconductor device, and method for manufacturing b2025
Bonded body, circuit board, semiconductor device, and method for manufacturing b2025
Bonded body, circuit board, semiconductor device, and method for manufacturing b2025
Umami-enhancing composition, seasoning or extract, method for manufacturing umam2025
Electronic device and wrist device2025
Bonded body including titanium alloy at bonding boundary2025
Bonded body including titanium alloy at bonding boundary2025
Bonded body including titanium alloy at bonding boundary2025
Structure and bonded body2025
Bonded assembly, and ceramic circuit substrate and semiconductor device using th2025
Electronic device and antenna characteristic adjusting method2025