Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for forming a trench in a first semiconductor layer of a multi-layer system

Method for forming a trench in a first semiconductor layer of a multi-layer system

US Patent 12094717 · Granted Sep 17, 2024

Estimated economic value: $10,392,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for producing a bonding pad for a micromechanical sensor element2025
Method for producing a bonding pad for a micromechanical sensor element2025
Micromechanical system, method for operating a micromechanical system2024
Micromechanical device and corresponding production method2021
Micro-mechanical component2018