Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive

Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive

US Patent 12080672 · Granted Sep 3, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Expansion controlled structure for direct bonding and method of forming same2025
Expansion controlled structure for direct bonding and method of forming same2025
Integrated cooling assembly with upper and lower channels2025
Directly bonded metal structures having aluminum features and methods of prepari2025
Embedded organic interposer for high bandwidth2025
Embedded organic interposer for high bandwidth2025
Package-on-package assembly with wire bonds to encapsulation surface2025
Metal pads over TSV2025
Metal pads over TSV2025
Metal pads over TSV2025
Metal pads over TSV2025
3D NAND-high aspect ratio strings and channels2025