Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Reinforced semiconductor device packaging and associated systems and methods

Reinforced semiconductor device packaging and associated systems and methods

US Patent 12080616 · Granted Sep 3, 2024

Estimated economic value: $19,072,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device assemblies with balanced wires, and associated methods2025
Fan-out packaging for a multichip package2025
Conductive adhesive assembly for semiconductor die attachment2025
Three dimensional semiconductor trace length matching and associated systems and2025
Surface mount device bonded to an inner layer of a multi-layer substrate2025
Split via structure for semiconductor device packaging2025
Microelectronic device packages and related methods and systems2025
Methods and apparatus for using spacer-on-spacer design for solder joint reliabi2025
Methods and apparatus for using spacer-on-spacer design for solder joint reliabi2025
Semiconductor devices with flexible spacer including a support structure and met2025
Semiconductor devices with flexible spacer including a support structure and met2025
Apparatus including direct-contact heat paths and methods of manufacturing the s2025