Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Device including semiconductor chips and method for producing such device

Device including semiconductor chips and method for producing such device

US Patent 12027481 · Granted Jul 2, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Device including semiconductor chips and method for producing such device2025
Device including semiconductor chips and method for producing such device2025
Electronic device with castellated board2025
Method for fabricating a semiconductor device package comprising a pin in the fo2025
Pre-packaged chip, method of manufacturing a pre-packaged chip, semiconductor pa2025
Electrostatic discharge protection of electronic component embedded in laminate 2025
Semiconductor device arrangement with compressible adhesive2025
Semiconductor devices including parallel electrically conductive layers2025
Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on2025
Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on2025
Power semiconductor package having first and second lead frames2025
Die package and method of forming a die package2024