Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermal control wafer with integrated heating-sensing elements

Thermal control wafer with integrated heating-sensing elements

US Patent 12013432 · Granted Jun 18, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Carrier based high volume system level testing of devices with pop structures2025
Integrated test cell using active thermal interposer (ATI) with parallel socket 2025
Wafer scale active thermal interposer for device testing2025
Passive carrier-based device delivery for slot-based high-volume semiconductor t2025
Thermal head comprising a plurality of adapters for independent thermal control 2025
Thermal head comprising a plurality of adapters for independent thermal control 2025
Multiplexed thermal control wafer and coldplate2025
Multiplexed thermal control wafer and coldplate2025
Multiplexed thermal control wafer and coldplate2025
Active thermal interposer device2025
Active thermal interposer device2025
Shielded socket and carrier for high-volume test of semiconductor devices2025