Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Control of processing parameters during substrate polishing using expected future parameter changes

Control of processing parameters during substrate polishing using expected future parameter changes

US Patent 11969854 · Granted Apr 30, 2024

Estimated economic value: $79,776,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Control substrate polishing using constrained cost function2025
Control substrate polishing using constrained cost function2025
In-situ monitoring to label training spectra for machine learning system for spe2025
Determining substrate orientation with acoustic signals2025
Polishing apparatus using neural network for monitoring2025
Semiconductor fabrication using process control parameter matrix2025
Pressure signals with different frequencies during friction monitoring to provid2025
Control of processing parameters during substrate polishing using cost function2025
Control of processing parameters during substrate polishing using cost function2025
Determining substrate precession with acoustic signals2025
Methods of modeling and controlling pad wear2025
Control of processing parameters for substrate polishing with substrate precessi2025