Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Efficient wave guide transition between package and PCB using solder wall

Efficient wave guide transition between package and PCB using solder wall

US Patent 11963291 · Granted Apr 16, 2024

Estimated economic value: $33,109,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System2025
Semiconductor device package having thermal dissipation feature and method there2025
Semiconductor device with RF interposer and method therefor2025
Semiconductor device with enclosed cavity and method therefor2025
Semiconductor device structure and method therefor2025
Semiconductor device with open cavity and method therefor2025
Semiconductor device with low loss waveguide interface and method therefor2025
Semiconductor device with open cavity and method therefor2025
Selective underfill assembly and method therefor2024
Semiconductor device packaging warpage control2024
Semiconductor device with self-aligned waveguide and method therefor2024
Semiconductor device with connector in package and method therefor2024