Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device

Assignee

• Mitsubishi Gas Chemical Company

Inventors

• Masashi Okaniwa (3 patents)
• Takenori Takiguchi (5 patents)
• Kohei Higashiguchi (4 patents)
• Tsuyoshi Kida (24 patents)

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