Resin composition, laminate including the resin composition, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device including the semiconductor wafer with resin composition layer

Assignee

• Mitsubishi Gas Chemical Company

Inventors

• Takenori Takiguchi (5 patents)
• Kohei Higashiguchi (4 patents)
• Tsuyoshi Kida (24 patents)

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