Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package structure and method of forming the same

Package structure and method of forming the same

US Patent 11855058 · Granted Dec 26, 2023

Estimated economic value: $1,986,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and method of forming the same2025
Heterogeneous bonding structure and method forming same2025
Heterogeneous bonding structure and method forming same2025
MIMcap corner structures in the keep-out zones of a semiconductor die and method2025
Packages with stacked dies and methods of forming the same2025
Inverted trapezoidal heat dissipating solder structure and method of making the 2025
Inverted trapezoidal heat dissipating solder structure and method of making the 2025
Bump structure and method of manufacturing bump structure2025
Semiconductor device2025
Bonding structures in semiconductor packaged device and method of forming same2025
Chip structure and method for forming the same2025
Chip structure and method for forming the same2025