Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Alternative surfaces for conductive pad layers of silicon bridges for semiconductor packages

Alternative surfaces for conductive pad layers of silicon bridges for semiconductor packages

US Patent 11848259 · Granted Dec 19, 2023

Estimated economic value: $50,836,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Data storage device and method for hybrid space balancing based on host read aff2025
Substrateless double-sided embedded multi-die interconnect bridge2025
Steel material, for pressure vessel, showing excellent hydrogen-induced cracking2025
Semiconductor package2025
Nested architectures for enhanced heterogeneous integration2025
Alternative surfaces for conductive pad layers of silicon bridges for semiconduc2025
Alternative surfaces for conductive pad layers of silicon bridges for semiconduc2025
Semiconductor package2025
Steel plate for pressure vessel having excellent hydrogen induced cracking resis2025
Ultrahigh-strength steel having excellent cold workability and SSC resistance, a2025
EMIB architecture with dedicated metal layers for improving power delivery2025
Metal-free frame design for silicon bridges for semiconductor packages2024