Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package with nickel-silver pre-plated leadframe

Semiconductor package with nickel-silver pre-plated leadframe

US Patent 11848258 · Granted Dec 19, 2023

Estimated economic value: $27,004,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic device with post mold plated nickel tungsten and tin bilayer for impr2025
Neutral pH copper plating solution for undercut reduction2025
Contact with bronze material to mitigate undercut2025
Substrates with solder barriers on leads2025
Chemically anchored mold compounds in semiconductor packages2024
Semiconductor package with nickel-silver pre-plated leadframe2024
Semiconductor package with nickel-silver pre-plated leadframe2024
Filler particles for polymers2024
Die attach surface copper layer with protective layer for microelectronic device2024
Plating for thermal management2024
Method of forming brass-coated metals in flip-chip redistribution layers2024
SP2-bonded carbon structures2024