Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device package having stress isolation and method therefor

Semiconductor device package having stress isolation and method therefor

US Patent 11823968 · Granted Nov 21, 2023

Estimated economic value: $38,438,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device with attached battery and method therefor2025
Semiconductor device with attached battery and method therefor2025
Semiconductor device package having thermal dissipation feature and method there2025
Semiconductor device package having thermal dissipation feature and method there2025
Semiconductor device with embedded battery and method therefor2025
Semiconductor device with RF interposer and method therefor2025
Semiconductor device with enclosed cavity and method therefor2025
Semiconductor device with enclosed cavity and method therefor2025
Semiconductor device structure and method therefor2025
Semiconductor device with open cavity and method therefor2025
Semiconductor device with open cavity and method therefor2025
Semiconductor device with low loss waveguide interface and method therefor2025