Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package substrate with a smooth groove about a perimeter of a semiconductor die

Semiconductor package substrate with a smooth groove about a perimeter of a semiconductor die

US Patent 11791289 · Granted Oct 17, 2023

Estimated economic value: $20,967,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor die with stepped side surface2024
Semiconductor package substrate with a smooth groove about a perimeter of a semi2022
Semiconductor package substrate with a smooth groove about a perimeter of a semi2022
Semiconductor package substrate with a smooth groove about a perimeter of a semi2022
Leadframe with die pad having cantilevers to secure electronic component2021
Leadframe with die pad having cantilevers to secure electronic component2021
Leadframe with die pad having cantilevers to secure electronic component2021
Planar leadframe substrate having a downset below within a die area2017
Definition of anti-fuse cell for programmable gate array application2001
Multiple storage planes Read Only Memory integrated circuit device1999
Definition of anti-fuse cell for programmable gate array application1999