Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for processing a layer structure and microelectromechanical component

Method for processing a layer structure and microelectromechanical component

US Patent 11787686 · Granted Oct 17, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

MEMS sensor with particle filter and method for producing it2025
3D dome wafer-level package for optical mems mirror with reduced footprint2025
Method with mechanical dicing process for producing MEMS components2024
Method of manufacturing a semiconductor device having frame structures laterally2024
Method with stealth dicing process for fabricating MEMS semiconductor chips2024
Semiconductor device having alignment pads and method of manufacturing the same2023
Carrier, laminate and method of manufacturing semiconductor devices2023
Vertical power semiconductor device, semiconductor wafer or bare-die arrangement2022
Methods for producing thin-film layers and microsystems having thin-film layers2022
Semiconductor package devices and method for forming semiconductor package devic2022
Method for manufacturing an opening structure and opening structure2022
Semiconductor device and method of manufacturing a semiconductor device2021