Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chip-stacked semiconductor package with increased package reliability

Chip-stacked semiconductor package with increased package reliability

US Patent 11756935 · Granted Sep 12, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package including a plurality of semiconductor chips2025
Cleaner2025
Carrier structure including pockets for accommodating semiconductor chip stack s2025
Carrier structure including pockets for accommodating semiconductor chip stack s2025
Integrated circuit device having redistribution pattern2024
Semiconductor package including test bumps2024
Vacuum cleaner2024
Filter and vacuum canister cleaner2024
Upper electrode and substrate processing apparatus including the same2024
Vacuum cleaner2023
Semiconductor package and method of manufacturing the same2023
Semiconductor package and method of manufacturing the same2023