Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic package including a hybrid thermal interface material and low temperature solder patterns to improve package warpage and reliability

Electronic package including a hybrid thermal interface material and low temperature solder patterns to improve package warpage and reliability

US Patent 11749631 · Granted Sep 5, 2023

Estimated economic value: $187,157,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wafer level integration of passive devices2025
Thermally enhanced chip-on-wafer or wafer-on-wafer bonding2025
Microelectronic package RDL patterns to reduce stress in RDLs across components2025
Interconnecting a plurality of dies having spare input/output circuit2025
High bandwidth die to die interconnect with package area reduction2025
High bandwidth die to die interconnect with package area reduction2025
Optical film, backlight module, and display device2025
Wafer reconstitution and die-stitching2025
Wafer reconstitution and die-stitching2025
High density interconnection using fanout interposer chiplet2025
High density interconnection using fanout interposer chiplet2025
Structure and method for sealing a silicon IC2025