Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Materials and methods for forming resist bottom layer

Materials and methods for forming resist bottom layer

US Patent 11703766 · Granted Jul 18, 2023

Estimated economic value: $10,411,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and user equipment for determining precoder of MIMO system2025
Film deposition for patterning process2025
Photoresist composition and method of manufacturing a semiconductor device2025
Non-DMSO stripper for advance package metal plating process2025
EUV metallic resist performance enhancement via additives2025
Method of manufacturing semiconductor devices and pattern formation method2025
Method of manufacturing a semiconductor device2025
Method of manufacturing a semiconductor device2025
Treatment of spin on organic material to improve wet resistance2025
Method for forming and using mask2025
Level shifter2025
Semiconductor device and method2025