{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Core cavity noise isolation structure for use in chip packages", "item": "https://www.patentleaderboard.com/patent/11688675"}]}
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Home › Core cavity noise isolation structure for use in chip packages

Core cavity noise isolation structure for use in chip packages

US Patent 11688675 · Granted Jun 27, 2023

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