Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Device with embedded high-bandwidth, high-capacity memory using wafer bonding

Device with embedded high-bandwidth, high-capacity memory using wafer bonding

US Patent 11670620 · Granted Jun 6, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Current source for read of programmable resistance memory cells2025
Methods for fabricating a 3-dimensional memory structure of nor memory strings2025
Thin film storage transistor with silicon oxide nitride charge trapping layer2025
High capacity memory circuit with low effective latency2025
High capacity memory circuit with low effective latency2025
High capacity memory circuit with low effective latency2025
High capacity memory circuit with low effective latency2025
Device with embedded high-bandwidth, high-capacity memory using wafer bonding2025
Device with embedded high-bandwidth, high-capacity memory using wafer bonding2025
Device with embedded high-bandwidth, high-capacity memory using wafer bonding2025
Device with embedded high-bandwidth, high-capacity memory using wafer bonding2025
Device with embedded high-bandwidth, high-capacity memory using wafer bonding2025