Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Laser-releasable bonding materials for 3-D IC applications

Laser-releasable bonding materials for 3-D IC applications

US Patent 11610801 · Granted Mar 21, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Laser printed lensed optical fibers and associated methods2025
Positive electrode active material and preparation method thereof, positive elec2025
Positive electrode active material and preparation method thereof, positive elec2025
Temporary bonding and debonding process to prevent deformation of metal connecti2025
Temporary bonding and debonding process to prevent deformation of metal connecti2025
Positive electrode active material and preparation method thereof, positive elec2025
Passive combined indoor positioning system and method based on intelligent termi2025
Crystal form of pyridopyrimidine derivative and preparation method thereof2025
Temperature sensor probe2024
Positive electrode active material and preparation method thereof, positive elec2024
Multifunctional materials for temporary bonding2024
Multifunctional materials for temporary bonding2024