Reconstituted wafer including integrated circuit die mechanically interlocked with mold material

Assignee

• Rockwell Collins

Inventors

• Richard Korneisel (8 patents)
• Nathaniel P. Wyckoff (20 patents)
• Brandon C. Hamilton (22 patents)
• Bret W. Simon (12 patents)
• Jacob R. Mauermann (6 patents)

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