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Home › Semiconductor package having an additional material with a comparative tracking index (CTI) higher than that of encapsulant resin material formed between two terminals

Semiconductor package having an additional material with a comparative tracking index (CTI) higher than that of encapsulant resin material formed between two terminals

US Patent 11545419 · Granted Jan 3, 2023

Estimated economic value: $517,000 ⓘ

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