Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods

Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods

US Patent 11527459 · Granted Dec 13, 2022

Estimated economic value: $12,619,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device assemblies with balanced wires, and associated methods2025
Wire bonding for stacked memory dies2025
Flexible interposer for semiconductor dies2025
Overlapping die stacks for NAND package architecture2025
Three dimensional semiconductor trace length matching and associated systems and2025
Three dimensional semiconductor trace length matching and associated systems and2025
Three dimensional semiconductor trace length matching and associated systems and2025
Three dimensional semiconductor trace length matching and associated systems and2025
Surface mount device bonded to an inner layer of a multi-layer substrate2025
Surface mount device bonded to an inner layer of a multi-layer substrate2025
Surface mount device bonded to an inner layer of a multi-layer substrate2025
Surface mount device bonded to an inner layer of a multi-layer substrate2025