Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Strain-induced shift mitigation in semiconductor packages

Strain-induced shift mitigation in semiconductor packages

US Patent 11430747 · Granted Aug 30, 2022

Estimated economic value: $35,135,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package for stress isolation2025
Semiconductor package for stress isolation2025
Flip chip semiconductor device package with mold compound seal2025
Flip chip semiconductor device package with mold compound seal2025
Semiconductor device package with reduced stress2024
Semiconductor device package with reduced stress2024
Strain-induced shift mitigation in semiconductor packages2024
Strain-induced shift mitigation in semiconductor packages2024
IC having a metal ring thereon for stress reduction2024
IC having a metal ring thereon for stress reduction2022
Semiconductor package with filler particles in a mold compound2021
Semiconductor package with a wire bond mesh2021