Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor dice assemblies, packages and systems, and methods of operation

Semiconductor dice assemblies, packages and systems, and methods of operation

US Patent 11380665 · Granted Jul 5, 2022

Estimated economic value: $11,496,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Repair techniques for coupled memory dies2025
Polymer coated semiconductor devices and hybrid bonding to form semiconductor as2025
Anisotropic conductive film with carbon-based conductive regions having void spa2025
Device packages including redistribution layers with carbon-based conductive ele2025
Modular construction of hybrid-bonded semiconductor die assemblies and related s2025
Memory with parallel main and test interfaces2025
Systems and methods for direct bonding in semiconductor die manufacturing2025
Methods of forming microelectronic device assemblies and packages2025
Use of pre-channeled materials for anisotropic conductors2024
Semiconductor assemblies with system and methods for aligning dies using registr2024
Thermal management of GPU-HBM package by microchannel integrated substrate2024
Anisotropic conductive film with carbon-based conductive regions and related sem2024