Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package structure and method of fabricating the same

Package structure and method of fabricating the same

US Patent 11362009 · Granted Jun 14, 2022

Estimated economic value: $8,576,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Polymer layers embedded with metal pads for heat dissipation2025
Semiconductor structure and manufacturing method thereof2025
Multilayer stacking wafer bonding structure and method of manufacturing the same2025
Wafer structure including probe marked test pads2025
Semiconductor package structure and manufacturing method thereof2025
Methods and apparatus for package with interposers2025
Methods and apparatus for package with interposers2025
Package structure and method of manufacturing the same2025
Package structure and method of manufacturing the same2025
Through-substrate via test structure2025
Integrated devices in semiconductor packages and methods of forming same2025
Barrier structures between external electrical connectors2025