Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electrical interconnect structure with radial spokes for improved solder void control

Electrical interconnect structure with radial spokes for improved solder void control

US Patent 11355429 · Granted Jun 7, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic devices including vent openings and associated methods2025
Leadframe, semiconductor package and method2025
Method of soldering a semiconductor chip to a chip carrier2024
Method of soldering a semiconductor chip to a chip carrier2024
Stacked transistor chip package with source coupling2024
Package with clip having through hole accommodating component-related structure2024
Semiconductor arrangement and method for producing a semiconductor arrangement2024
Robust and fast design of microgrids, der systems, and other energy systems usin2024
Semiconductor package, metal sheet for use in a semiconductor package, and metho2024
Semiconductor package and clip with a die attach2024
Semiconductor device having a contact clip with a contact region having a convex2024
Chip with chip pad and associated solder flux outgassing trench2023