Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Leadframe leads having fully plated end faces

Leadframe leads having fully plated end faces

US Patent 11342252 · Granted May 24, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of manufacturing a package using a clip having at least one locking reces2025
Semiconductor device having a carrier, semiconductor chip packages mounted on th2024
Molded semiconductor package having a negative standoff2024
Method of fabricating a semiconductor package2023
Clip having locking recess for connecting an electronic component with a carrier2023
Plurality of transistor packages with exposed source and drain contacts mounted 2023
Chip to chip interconnect in encapsulant of molded semiconductor package2023
Lead frame-based semiconductor package2022
Semiconductor package and method of fabricating a semiconductor package2022
Semiconductor package with top or bottom side cooling and method for manufacturi2021
Chip to chip interconnect in encapsulant of molded semiconductor package2021
Semiconductor package having leads with a negative standoff2021