Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor devices including enlarged contact hole and methods of forming the same

Semiconductor devices including enlarged contact hole and methods of forming the same

US Patent 11329053 · Granted May 10, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Dielectric material, device including the same, and method of preparing the diel2025
Apparatus for treating substrate and method for treating substrate2025
Apparatus for treating substrate and method for treating substrate2025
Substrate processing apparatus and apparatus for manufacturing integrated circui2024
Substrate processing apparatus2023
Substrate processing apparatus and substrate processing system including the sam2022
Perovskite oxide catalyst having improved oxygen catalytic activity and preparat2022
Substrate processing apparatus and apparatus for manufacturing integrated circui2021
Integrated circuit devices including a boron-containing insulating pattern2021
Semiconductor devices including enlarged contact hole and methods of forming the2021
Semiconductor devices including enlarged contact hole and methods of forming the2021
Semiconductor devices including enlarged contact hole and methods of forming the2021