Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package substrate including segment grooves arranged in a radial direction of a redistribution pad and semiconductor package including the same

Package substrate including segment grooves arranged in a radial direction of a redistribution pad and semiconductor package including the same

US Patent 11302661 · Granted Apr 12, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fan-out semiconductor package2025
Semiconductor package including redistribution pattern2025
Package substrate and semiconductor package including the same2024
Package substrate and semiconductor package including the same2024
Package substrate and semiconductor package including the same2024
Semiconductor package2024
Package substrate including a redistribution pad extending from a redistribution2023
Package substrate including a redistribution pad extending from a redistribution2023
Package substrate including a redistribution pad extending from a redistribution2023
Method of manufacturing connection structure of semiconductor chip and method of2022
Method of manufacturing connection structure of semiconductor chip and method of2022